• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Chip ejector (100; 200) having a fixing unit (130) and at least one or preferably a plurality of conveying units (140; 141; 143; 145) located outside the fixing unit (130) and connected to a belt (120). mounted on one side to upper portions of the conveyor units (141; 143; 145) and on the other side of which a chip (110) is mounted, to be moved downwardly to feed the chip (110) from the belt (120) separate.
    公开号:AT513202A2
    申请号:T50414/2012
    申请日:2012-09-28
    公开日:2014-02-15
    发明作者:
    申请人:Samsung Electro Mech；
    IPC主号:
    专利说明:

    1
    The invention relates to a chip ejector, and more particularly to a chip ejector for separating a chip from a film tape, and a method for chip removal.
    In order to implement high-density component mounting in a semiconductor device, a stack package has recently been put on the market in which a plurality of semiconductor chips are three-dimensionally mounted on a wiring substrate. In this case, the thickness of a semiconductor chip may be several tens of jM or less.
    For mounting such a thin semiconductor chip on a wiring substrate, an integrated circuit protection tape is bonded to a peripheral surface of a semiconductor wafer in which the integrated circuit is formed, and the back surface of the semiconductor wafer is polished and etched in this state; thus its thickness is significantly reduced in a range of several tens of μχΆ.
    Such a semiconductor thin wafer whose backside is bonded to a bonding tape is cut so that the semiconductor wafer is divided into a plurality of individual chips.
    Thereafter, the back side of the bonding tape is rolled by means of a pin and the like, so that the semiconductor chips can be successively removed from the bonding tape.
    The semiconductor chip removed from the bonding tape is mounted on the wiring substrate. However, during assembly of a package using such a thin chip, cracks or 2/26 2 may easily occur
    Defects in a chip occur when individual chips that have been split by cutting are removed and lifted off the bonding tape, and therefore development of a method in which occurrence of cracks or defects is prevented is urgently required.
    US 2004-0105750 A discloses an apparatus for removing a semiconductor chip from a tape by means of a pen.
    However, due to a collision between the semiconductor chip and the pin, pressure may be concentrated on a small area of a semiconductor chip, and the thickness of the semiconductor chip may be reduced due to high integration of the semiconductor chip, which may cause cracks in the semiconductor chip upon impact of the pin on the semiconductor chip ,
    One aspect of the present invention provides a chip ejector and a chip removal method, with which it is possible to prevent damage to a chip, such as cracks and technical defects, thereby avoiding unnecessary manufacturing costs due to defective chips and to stably disconnect the chip from a tape.
    According to one aspect of the present invention, a chip ejector is provided, which is characterized by a fixing unit for the band and by at least one, preferably a plurality of conveyor units, which are located outside of the fixing unit, and with the band, that with one side to upper Sections of the conveyor units is fixed, are arranged downwardly falling movable to separate the chip from the belt.
    The individual conveyor units may be movable in succession 3/26 3, e.g. in turn from outside to inside or from inside to outside.
    The fixing unit and the conveyor units may have a through hole that passes through the upper and lower sides thereof.
    At least one pin may be inserted in the through hole formed in the fixing unit.
    Air can be sucked through the or each through hole of the conveyor units, so that the tape is held and fixed to the conveyor units.
    The chip ejector may further include a receiving unit which receives the chip separated from the tape.
    The chip ejector may further include a conveyor unit actuator that transfers energy to the conveyor units.
    According to a further aspect of the invention, there is provided a method of chip removal in which a chip is attached to a tape, wherein it is provided that the tape with the chip on a surface of a fixing unit and on a surface of at least one, preferably a plurality of conveyor unit (s ), which are located outside of the fixing unit, wherein the band on the surfaces of the fixing and conveying units by sucking air through through holes which are formed in the fixing and the conveyor units and is held, after which the (single) conveyor unit ( en), so that they move in succession falling.
    The individual conveyor units can be sequentially dropped inward from outside 4/26 4, but they can also "fall in" from the inside to the outside in turn.
    Furthermore, it is advantageous if the tape to which the chip is attached is pushed upwards by means of a pin which is inserted in the through hole formed in the fixing unit, the pin projecting outwards from the fixing unit.
    It is also advantageous if the band to which the chip is attached is displaced upward by passing air through the through-hole formed in the fixing unit.
    Finally, it is advantageous if the chip is held on a receiving unit and fixed and separated from the tape by moving the receiving unit.
    The above and other aspects, features and other advantages of the invention will be further elucidated hereinbelow by way of preferred embodiments, to which, however, they should not be limited, and with reference to the drawings. In the drawings: FIG. 1 is a cross-sectional view of a chip ejector according to one embodiment of the invention; FIG. FIG. 2 is a plan view of a fixing unit of this chip ejector; FIG. FIG. Fig. 3 is a cross-sectional view of a conveyor unit of this chip ejector during "falling";
    The FIG. FIGS. 4 to 7 are further cross-sectional views of the delivery unit of the chip ejector of FIG. 1 during various stages of "falling "; FIG. Fig. 8 is a cross-sectional view of a chip ejector according to Fig. 5/26 of a second embodiment of the invention; and
    The FIG. 9-13 are cross-sectional views of the conveyor unit of this chip ejector at different times during the "fall.
    In the drawing, the shapes and dimensions of elements may be exaggerated for clarity; the same reference numerals are used to designate the same or similar elements in the various figures. FIG. 1 shows a cross-sectional view of a chip ejector 100, and FIG. 2 shows a plan view of a fixing unit 130 of this chip ejector 100.
    According to FIG. 1 to 3, the chip ejector 100 has, in addition to the fixing unit 130, a conveying unit 140 and a receiving unit 160 as well as a conveying unit actuating device 170.
    A tape 120 to which a chip 110 is attached may be disposed on a side or surface of the fixing unit 130. The one surface (top) of the fixing unit 130 may be formed to be flat so that the tape 120 may be attached to it.
    The cross-section of the fixing unit 130 may be rectangular, but is not limited thereto, and as long as the tape 120 can be fixed to a surface, any cross-sectional shape may be used. At least one through hole 130a may be formed in the center of the fixing unit 130 so as to extend from the upper side to the lower side.
    Although only one through hole 130a formed in the fixing unit 130 is shown in the drawing, it is understood that a plurality of through holes 130a may be formed therein as well.
    In a final step of separating the chip 110 from the tape 120 (see Fig. 7), the tape 120 is pushed up by means of air blown up through the through hole 130a, so that the chip 110 is removed from the tape 12 0 can be disconnected.
    The process of separating the chip 110 from the tape 120 by the chip ejector 100 will be described below with reference to FIGS. 3 to 8 will be described in more detail.
    The conveying unit 140 may be located outside of the fixing unit 130. The belt 120 may be mounted on a surface of the conveyor unit 140. In other words, the tape 120 is attached to a surface of the fixing unit 130 and to a surface of the conveying unit 140.
    The surface of the conveyor unit 140 may be formed so that it is flat, so that the belt 120 can be attached to this surface of the conveyor unit 140. The surface of the fixing unit 130 and the surface of the conveying unit 140 may be on the same plane.
    The conveying unit 140 may be formed in detail in the form of a plurality of conveying units 141, 142, 143 as shown in the drawing. Although FIG. 1 and 2 show three conveyor units 141, 143 and 145, the number of conveyor units is not limited to when the entire conveyor unit 140 is formed in the form of a plurality of conveyor units.
    In each of the conveying units 141, 143, 145, at least one or a plurality of through holes 141a, 143a, 7/26, 7 and 145a may pass through the top and the bottom.
    Air can be sucked through the through holes 141a, 143a, and 145a, so that the tape 120 can be held and fixed to a surface of the fixing unit 130 and a surface of the conveyer unit 140.
    The diameter of the through-holes 130a, 141a, 143a, and 145a formed in the fixing unit 130 and the conveying unit 140 may be such that the band 120 can not be drawn into the through-holes 130a, 141a, 143a, and 145a. Therefore, even if air is sucked through the through holes 130, 141 a, 143 a and 145 a, the band 120 can not in the
    Through holes 141a, 143a and 145a are drawn in, and it can be held and fixed to the surfaces of the fixing unit 130 and the conveyor unit 140.
    The conveyor unit 140 may be configured to be moved down ("falling") or upwards due to the conveyor unit actuator 170. The conveyor unit actuator 170 may comprise a general means, e.g. a rod-like cam or cylinder.
    More in detail, e.g. an elastic force is applied to the conveyer unit 140 by mounting an elastic member (see Fig. 3) on the lower surface of the conveyer unit 140, and the individual sub-conveyer units 141, 143, 145 of the conveyer unit 140 can be rotated by turning the rod-like member Cam (not shown) are driven in turn downwards or upwards.
    The individual conveyor units 141, 143, 145 may "fall" in turn at 8/26 8 predetermined intervals. In the chip ejector 100 of FIGS. 1 to 7, " fall " the individual conveyor units 141, 143, 145 successively from outside to inside.
    When the individual conveyor units 141, 143, 145 in a state where the belt 120 is held and fixed to the surfaces of the fixing unit 130 and the entire conveyance unit 140 are sequentially "dropped" from outside to inside, as shown in FIGS 4 to 6, the belt 120, which is held and fixed to the conveyor unit 140, may also be moved downwardly in sections, together with the conveyor unit 140. Therefore, the chip 110 can be successively separated from the tape 120.
    Even though the conveyor unit 140 has been moved downwards and the belt 120 held and fixed to the surface of the conveyor unit 140 has been separated from the chip 110 (see Fig. 7), the chip 110 is still attached to the belt 120, which is still held on the surface of the fixing unit 130.
    In this regard, the belt 120 may be displaced upward by air blown upward by the through hole 130a formed in the fixing unit 130.
    As the belt 120 is moved upward, the surface area of the chip 110 attached to the belt 120 becomes smaller, thereby minimizing the area of the chip 110 attached to the belt 120.
    The receiving unit 160 may be located above the fixing unit 130 and the conveying unit 140.
    Although FIG. 1 shows that the receiving unit 160 is in contact with the chip 110 fixed to the band 120, the receiving unit 160 may be in a state of not contacting the chip 110 above the fixing unit 130 and the conveyor unit 140 are located.
    After the conveying unit 140 has been moved down and the part of the chip 110 fixed to the film tape 120 is air-blown upwardly through the through-hole 130a formed in the fixing unit 130 and upwardly displacing the tape 120 7, the chip 110 can be completely separated from the tape 120 by allowing the receiving unit 160 to receive the chip 110.
    For this, a through hole 161 passing from the top to the bottom through the receiving unit 160 may be formed in the center of the receiving unit 160, and air may be sucked through the through hole 161.
    Therefore, the chip 110 can be held by the receiving unit 160 and completely separated from the belt 120 by (moving) the pickup unit 160. FIGS. 3 to 7 are cross-sectional views of the conveyor units 141, 143, 145 of the chip ejector 100, which are sequentially moved downwardly from outside to inside, with various successive phases of this "falling" being shown in Figs. are illustrated. The process of separating the chip 110 from the tape 120 using the chip ejector 100 of FIGS. 1 to 7 will now be described below with reference to FIG. 3 to 7 described in more detail.
    As shown in FIG. 3, the tape 120 to which the chip 110 is attached is attached to the top of the fixing unit 130 and the conveyer unit 140 located laterally outside the fixing unit 130 (see Fig. 2). Air is sucked by the through holes 141a, 143a and 145a formed in the conveyer unit 140, so that the band 120 is held and fixed to the surface of the fixing unit 130 and the surface of the conveyer unit 140.
    The individual conveyor units 141, 143, 145 of the conveyor unit 140 are sequentially transferred down to a state wherein the belt 120 is retained and fixed to the surface of the fixing unit 130 and to the partial surfaces of the conveyor units 141, 143, 145. In this case, the individual conveyor units 141, 143, 145 are moved downwards in series from the outside in, but if necessary also vice versa, i. in turn from the inside out.
    When the conveyor units 141, 143, 145 are moved downwardly, the belt 120 held and fixed to them moves down along with them, and thus the chip 110 can successively (see FIGS. 4, 5, and 6) of FIG Volume 120 are separated.
    After the delivery unit 140 has been moved completely down, air is blown upward by the through hole 130a formed in the fixing unit 130, or a pin (not shown in Fig. 7) inserted in the through hole 130a is shifted upward, in order to protrude outwards from the fixing unit 130, and thus the band 120 fixed and fixed to the fixing unit 130 can be pushed upward as shown in FIG. Accordingly, the area of the chip 110, 11/26 11 attached to the belt 120 is minimized.
    Finally, the chip 110 is held and fixed by sucking air through the through hole 161 formed in the receiving unit 160 on the receiving unit 160. Now, when the receiving unit 160 moves away in the state where the chip 110 is held and fixed to the receiving unit 160, the chip 110 is completely separated from the tape 120.
    The area of the chip 110 which adheres to the tape 120 is minimized due to the described actions of the conveyor unit 140 and the fixing unit 130, whereby the chip 110 can be gently separated from the tape 120, wherein the chip 110 is not damaged.
    Thereafter, the conveyer unit 140 may be lifted from the lower position to the original position, and another belt 120 to which a chip 110 is attached may be attached to the fixing unit 130 and the conveyer unit 140, and the above-mentioned operation may be performed to repeat.
    Accordingly, with the described chip ejector 100 damage to the chip 110 can be minimized because the tape 120 is held and fixed to the individual conveyor units 141, 143, 145 and the conveyor unit 140 and the conveyor units 141, 143, 145 with the belt 120th be successively moved down, so that the chip 110 is released from the tape 120. FIG. 8 shows a cross-sectional view of a chip ejector 200 according to a modified embodiment of the invention. FIG. FIGS. 9 through 13 are cross-sectional views of the conveyor units of this chip ejector which "fall" from the inside to the outside in order.
    The chip ejector 200 according to FIG. 8 largely corresponds to 12/26 12 that of FIG. 1 except for the operation of the conveyor unit 140 and a pin 250 in the fixing unit 130, and therefore a detailed description is omitted.
    The conveyor unit 140 may in turn be in the form of several, e.g. three conveyor units 141, 143, 145 may be formed, wherein the number of individual conveyor units should not be limited. The individual conveyor units 141, 143, 145 can in turn fall off in a predetermined (temporal) distance in sequence, wherein they according to Fig. 9 to 12 now, for example, in turn "from the inside to the outside" fall ".
    When the individual conveyor units 141, 143, 145 fall from the inside to the outside in a state where the belt 120 is held and fixed to the surface of the fixing unit 130 and the surface of the conveyor unit 140, the belt 120 that is attached to the Conveyor unit 140 is held and fixed, together with the conveyor unit 140 also move down. Therefore, the chip 110 can be successively separated from the tape 120.
    Even if the conveyer unit 140 falls off and the belt 120 held and fixed to the surface of the conveyer unit 140 is separated from the chip 110, the chip 110 is still attached to the belt 120 fixed to the surface of the fixing unit 130 (see Fig. 12). In this situation, as with the chip ejector 100 shown in Figs. 1 to 7, the belt 120 could be lifted up by means of air blown upward by the through hole 130a formed in the fixing unit 130. Alternatively, the tape 12 may be pushed upward using the pin 250 provided in the through hole 130a, as shown in FIG.
    The band 120 is lifted up, and thus the area of the chip 110 adhered to the band 120 is further reduced and minimized.
    Unlike the chip ejector 100 shown in FIGS. 1 to 7, the pin 250 inserted in the through hole 130a formed in the fixing unit 130 of the chip ejector 200 shown in FIGS. 8 to 13 in a final step of separating the chip 110 is lifted up from the tape 120, wherein the tape 120 is lifted upward by the pin 250 projecting from the fixing unit 130 to the outside. As a result, the chip 110 is finally disconnected from the tape 120.
    Even if the conveyor unit 140 drops and the belt 120 held and fixed to the surface of the conveyor unit 140 has been separated from the chip 110 in this area, the chip 110 still adheres to the belt 12 0 on the surface of the fixing unit 130 is attached (Fig. 12). For further separation of the chip 110 from the tape 120, as mentioned above, the pin 250 is pushed upward so as to project outwardly from the fixing unit 130, and thus the chip 110 is separated from the tape 120 (Fig 13).
    Now again air can be sucked through the formed in the receiving unit 160 through hole 161, and so the chip 110 can be picked up by the receiving unit 160 and moved away, whereby the chip 110 is completely separated from the band 12 0.
    Also in this embodiment, the chip ejector 200 acts to minimize damage to the chip 110 and to stably disconnect the chip 110 14/26 14 from the tape 12 0. Thereby, with the present chip ejecting method, a cost loss due to defective chips can be avoided, and the chips can be stably removed from the respective tape, whereby damage to the chip such as a chip, e.g. Cracks and technical defects should be avoided during the separation process.
    While the invention has been described above in connection with preferred embodiments, it will be understood by those skilled in the art that modifications and variations are possible without departing from the spirit and scope of the invention as defined in the claims. 15/26
    权利要求:
    Claims (15)
    [1]
    Claims 1. A chip ejector (100; 200) for a chip (110) mounted on one side of a belt (120), characterized by a fuser unit (130) for the belt (120) and at least one, preferably a plurality of conveyor units (140; 141; 143; 145) located outside of the fixing unit (130) and movably arranged downwardly movably with the band (120) fixed on one side to upper portions of the conveyor units (140) to separate the chip (110) from the tape (120).
    [2]
    2. Chip ejector according to claim 1, characterized in that the individual conveyor units (141, 142, 145) are falling in succession falling.
    [3]
    3. chip ejector according to claim 2, characterized in that the individual conveyor units (141, 143, 145) in turn from the outside to the inside are falling movable (Fig. 4-7).
    [4]
    4. Chip ejector according to claim 2, characterized in that the individual conveyor units (141; 143; 145) are successively movable from the inside to the outside (FIGS. 10-12).
    [5]
    5. Chip ejector according to claim 1, characterized in that the fixing unit (130) and the conveying unit (s) (140; 141; 143; 145) have a through-bore (130a; 141a; 143a; 145a). 16/26 16
    [6]
    6. Chip ejector according to claim 5, characterized in that in the fixing unit (130) formed through hole (130a) at least one pin (250) is inserted.
    [7]
    7. Chip ejector according to claim 5, characterized in that the through bores are suction bores to suck in air and thus to hold the band to the conveyor units (141, 143, 145).
    [8]
    8. chip ejector according to one of claims 1 to 7, characterized by a receiving unit (160) for receiving the band (120) separated from the chip (110).
    [9]
    A chip ejector according to any one of claims 1 to 8, characterized by conveyor unit actuating means (170) for transmitting energy to the conveyor units (141; 143; 145).
    [10]
    A method of chip removal in which a chip (110) is attached to a tape (120), characterized in that the tape (120) contacts the chip (110) on a surface of a fuser unit (130) and on a surface of at least one , preferably a plurality of conveyor unit (s) (140; 141; 143; 145), which are located outside of the fixing unit (130), wherein the band on the surfaces of the fixing and conveying units (130; 140; 141; 143; 145) by suction of air through through holes (130a, 141a, 143a, 145a) formed in the fixing and conveying units (130, 140, 141, 143, 145) and held, after which the (single) conveying unit (s ) (140; 17/26 17 141; 142; 143) so that they move in succession falling.
    [11]
    11. The method according to claim 10, characterized in that the individual conveyor units (141, 143, 145) in turn are driven from outside to inside to fall.
    [12]
    12. The method according to claim 10, characterized in that the individual conveyor units (141; 143; 145) are sequentially controlled from the inside to the outside for falling.
    [13]
    13. The method according to any one of claims 10 to 12, characterized in that the band (120) on which the chip (110) is fixed, by means of a pin (250) formed in the through hole formed in the fixing unit (130) ( 130a) is pushed upwardly with the pin (250) projecting outwardly from the fixing unit (130).
    [14]
    14. The method according to any one of claims 10 to 12, characterized in that the band (120) on which the chip (110) is fixed, is displaced upward by air through the through hole formed in the fixing unit (130) (130a ).
    [15]
    15. The method according to any one of claims 10 to 14, characterized in that the chip (110) on a receiving unit (160) held and fixed and separated from the belt (120) by moving the 18/26 18 receiving unit (160). 19/26
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    同族专利:
    公开号 | 公开日
    KR20140015851A|2014-02-07|
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    法律状态:
    2017-08-15| REJ| Rejection|Effective date: 20170815 |
    优先权:
    申请号 | 申请日 | 专利标题
    KR1020120081465A|KR101397750B1|2012-07-25|2012-07-25|Chip ejector and chip removal method using the same|
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